Title:
METHOD FOR MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2022/230821
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing an organic semiconductor element, the method comprising a step for applying and heating a first composition to provide a first functional film, and a step for applying a second composition on the first functional film to provide a second functional film, the first composition including a first functional material, wherein the first functional material includes an arylamine polymer having none of a bridging group, a polymerization group, or a cleavable solubilizing group, and having a weight-average molecular weight of 15000 to 50000 inclusive, and the second composition includes a solvent and has a viscosity of less than or equal to 15 mPa･s at 23℃, the solvent including at least one first solvent component having a viscosity of greater than or equal to 3 mPa･s at 23℃.
Inventors:
HOSHINA MAKOTO (JP)
OSHIMA YUKI (JP)
LI YANJUN (JP)
SHEN JUNWEI (JP)
OSHIMA YUKI (JP)
LI YANJUN (JP)
SHEN JUNWEI (JP)
Application Number:
PCT/JP2022/018762
Publication Date:
November 03, 2022
Filing Date:
April 25, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
H05B33/10; C08G61/12; C08G73/02; H01L51/50
Domestic Patent References:
| WO2020171190A1 | 2020-08-27 | |||
| WO2022059725A1 | 2022-03-24 |
Foreign References:
| JP2008198365A | 2008-08-28 | |||
| JP2019505986A | 2019-02-28 | |||
| JP2010059417A | 2010-03-18 | |||
| JP2010239125A | 2010-10-21 | |||
| JP2006190759A | 2006-07-20 | |||
| JP2009010343A | 2009-01-15 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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