Title:
METHOD FOR MANUFACTURING PELLICLE FOR EXTREME ULTRAVIOLET LITHOGRAPHY
Document Type and Number:
WIPO Patent Application WO/2023/090777
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a pellicle for extreme ultraviolet lithography. More specifically, the present invention relates to a method for manufacturing a pellicle for extreme ultraviolet lithography, the pellicle including a pellicle film having residual tensile stress. In order to accomplish the described objective, the present invention provides a method for manufacturing a pellicle for extreme ultraviolet lithography, comprising the steps of: a) forming, on a substrate, a pellicle film layer comprising a mixture layer including elements capable of forming a compound core layer through a chemical reaction; b) patterning the substrate so as to expose the pellicle film layer; and c) heat-treating the pellicle film layer so that the elements of the mixture layer react and shrink so as to form a core layer having residual tensile stress. According to the present invention, a pellicle comprising a pellicle film having residual tensile stress can be easily manufactured.
Inventors:
LEE YOUNG CHUL (KR)
IM GYUNG CHEOL (KR)
KIM CHEONG (KR)
IM GYUNG CHEOL (KR)
KIM CHEONG (KR)
Application Number:
PCT/KR2022/017818
Publication Date:
May 25, 2023
Filing Date:
November 14, 2022
Export Citation:
Assignee:
FINE SEMITECH CORP (KR)
International Classes:
G03F1/62; C23C14/34; G03F1/22
Foreign References:
| KR20200024117A | 2020-03-06 | |||
| KR20200141913A | 2020-12-21 | |||
| KR20180135490A | 2018-12-20 | |||
| KR20210090189A | 2021-07-19 | |||
| JPH09107113A | 1997-04-22 |
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
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