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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING PIEZOELECTRIC TRANSDUCER
Document Type and Number:
WIPO Patent Application WO/2022/213467
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a piezoelectric transducer, comprising: forming, on a piezoelectric wafer, a first mark parallel to or perpendicular to a preset direction of the piezoelectric transducer; forming, on a carrier wafer, a second mark parallel to or perpendicular to a cutting direction of the carrier wafer, the shape of the second mark being the same as that of the first mark; and aligning the first mark and the second mark, and then bonding the piezoelectric wafer and the carrier wafer to form a process wafer, a first surface of the process wafer where the piezoelectric wafer is provided being used for forming the piezoelectric transducer. According to the present application, the preset direction of the piezoelectric transducer is made to be parallel to or perpendicular to the cutting direction of the carrier wafer by means of the first mark on the piezoelectric wafer and the second mark on the carrier wafer, thereby achieving the purpose of improving the utilization rate of the available wafer area of the carrier wafer.

Inventors:
GONG SONGBIN (CN)
YANG YANSONG (CN)
Application Number:
PCT/CN2021/097219
Publication Date:
October 13, 2022
Filing Date:
May 31, 2021
Export Citation:
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Assignee:
SPECTRON SHENZHEN TECH CO LTD (CN)
International Classes:
H01L41/08; H01L41/312
Foreign References:
CN113270539A2021-08-17
CN111341904A2020-06-26
CN104925741A2015-09-23
CN104078446A2014-10-01
CN110600414A2019-12-20
CN110649140A2020-01-03
US20100244631A12010-09-30
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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