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Title:
METHOD FOR MANUFACTURING POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2022/202059
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a polishing pad that comprises a polishing layer having an endpoint detection window, the method including: a curing step for fixing an endpoint detection window member inside of a die, and curing a curable resin that is in contact with the endpoint detection window member so as to form a resin sheet in which the endpoint detection window member is incorporated; and a slicing step for slicing the resin sheet so as to form the polishing layer. In the curing step, the endpoint detection window member is fixed so as to be suspended from a position fixation jig which is installed on top of the die.

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Inventors:
KAWAMURA YOSHIHIDE (JP)
ITOYAMA KOUKI (JP)
SEKIYA HITOSHI (JP)
TATENO TEPPEI (JP)
KOIKE KENICHI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2022/007227
Publication Date:
September 29, 2022
Filing Date:
February 22, 2022
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/013; B24B37/22; B24B37/24; B24B37/26; C08G18/48; C08G18/75; C08J5/14; C08J7/00; H01L21/304
Foreign References:
JP2013539233A2013-10-17
JP2005210143A2005-08-04
JP2012524672A2012-10-18
JPS4530584B11970-10-03
JP2006069158A2006-03-16
JP2012071416A2012-04-12
JP2006110686A2006-04-27
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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