Title:
METHOD FOR MANUFACTURING PRINTED BOARD
Document Type and Number:
WIPO Patent Application WO/2021/210211
Kind Code:
A1
Abstract:
[Problem] To fill a through-hole of a printed board with a filler properly even when the printed board is of a type such that the through-hole is difficult to fill by conventional methods. [Solution] A seal film 12 is affixed to a lower surface of a printed board 10, and a filler 16 is pushed into a through-hole 11 from the upper surface side of the printed board 10 by screen printing under an evacuated atmosphere, thus filling the through-hole 11 with the filler 16. Thereafter, the film 12 is peeled off the printed board 10 and, in a state in which the printed board 10 is placed over a jig plate 18 having a recess 17 formed in a position corresponding to the through-hole 11, an auxiliary filling step is performed whereby a slight amount of the filler 16 is re-supplied so as to cause the filler 16 to protrude from the lower surface side of the through-hole 11.
Inventors:
MORI YASUMITSU (JP)
DOI AKIHIRO (JP)
DOI AKIHIRO (JP)
Application Number:
PCT/JP2020/043758
Publication Date:
October 21, 2021
Filing Date:
November 25, 2020
Export Citation:
Assignee:
NODA SCREEN CO LTD (JP)
International Classes:
H05K1/11; H05K3/28; H05K3/40
Foreign References:
| JP2008084993A | 2008-04-10 | |||
| JPH11220256A | 1999-08-10 | |||
| JP2005268828A | 2005-09-29 | |||
| JPH11317578A | 1999-11-16 | |||
| JP2003205594A | 2003-07-22 | |||
| JP2002164649A | 2002-06-07 | |||
| JPS57166095A | 1982-10-13 | |||
| JP2003309371A | 2003-10-31 | |||
| JP2009081305A | 2009-04-16 | |||
| JP2000133934A | 2000-05-12 | |||
| JP2003188308A | 2003-07-04 | |||
| JP2005057109A | 2005-03-03 |
Other References:
See also references of EP 3944728A4
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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