Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED THEREBY
Document Type and Number:
WIPO Patent Application WO/2018/097525
Kind Code:
A3
Abstract:
Provided is a method for manufacturing a printed circuit board in which a plurality of base sheets having an adhesive layer and an electrode formed on a hard film having a low dielectric constant are stacked to minimize dielectric loss due to high frequency signals and prevent the loss of the high frequency signals; and a circuit board manufactured thereby. The disclosed method for manufacturing a printed circuit board comprises the steps of: preparing a base sheet; preparing an adhesive sheet; preparing a flame retardant sheet; and laminating a plurality of base sheets, the adhesive sheet and the flame retardant sheet by applying heat and press, wherein the step of preparing a base sheet comprises the steps of: forming a sheet adhesive layer on one side of a hard polypropylene film; and forming an internal electrode on the other side of the hard polypropylene film.
Inventors:
DAN SUNG-BAEK (KR)
Application Number:
PCT/KR2017/012758
Publication Date:
August 09, 2018
Filing Date:
November 10, 2017
Export Citation:
Assignee:
AMOGREENTECH CO LTD (KR)
International Classes:
H05K3/10; H05K1/02; H05K3/02
Foreign References:
| KR20080031793A | 2008-04-11 | |||
| KR20120072691A | 2012-07-04 | |||
| US20110214906A1 | 2011-09-08 | |||
| US20100307803A1 | 2010-12-09 | |||
| US20070292668A1 | 2007-12-20 |
Attorney, Agent or Firm:
HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)
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