Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/189291
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a printed circuit board that has an excellent electromagnetic shielding layer coating property and excellent electromagnetic shielding characteristics. The method for manufacturing a printed circuit board, the printed circuit board comprising a printed wiring board having a ground wire, one or more semiconductor devices mounted in a region surrounded by the ground wire on the printed wiring board, an insulating layer in which at least one of the semiconductor devices is embedded and which is disposed inside the ground wire and has an inclined portion at the outer edge thereof, and an electromagnetic shielding layer disposed on the insulating layer, comprises: a step for forming the insulating layer having the inclined portion by, when layers are stacked by performing, a plurality of times, a step for forming layers by ejecting insulating ink by means of inkjet on a printed wiring board on which a semiconductor device is mounted, making the outer edge of an insulating ink-ejected region smaller in a stepwise manner from the printed wiring board side so as to form the inclined portion; and a step for forming the electromagnetic shielding layer by ejecting conductive ink on the insulating layer by means of inkjet.
Inventors:
SHIMOHARA NORIHIDE (JP)
FUJII YUSUKE (JP)
FUJII YUSUKE (JP)
Application Number:
PCT/JP2023/008610
Publication Date:
October 05, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L23/00; C09D11/30; C09D11/52; H01L23/12; H01L23/28; H05K1/02; H05K3/10; H05K3/28; H05K9/00
Foreign References:
| US20190103365A1 | 2019-04-04 | |||
| JP2019091866A | 2019-06-13 | |||
| JPH10214923A | 1998-08-11 | |||
| JP2002164479A | 2002-06-07 | |||
| JP2003347441A | 2003-12-05 | |||
| JP2006147650A | 2006-06-08 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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