Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT FILM ATTACHMENT-TYPE LED MODULE
Document Type and Number:
WIPO Patent Application WO/2014/058131
Kind Code:
A1
Abstract:
A method for manufacturing a printed circuit film attachment-type LED module according to the present invention comprises the steps of: discarding the release paper from a polyimide (PI) film; coating the PI film with an adhesive by applying heat and pressure; printing, with a conductive paste, a variety of patterns on the surface of the adhesive-coated PI film; plating the PI film via electrolysis after inserting the PI film, printed with a conductive paste, into a Cu electrolyte; printing SR paste on the surface of the Cu-plated PI film; printing solder cream on soldering parts of the PI film surface; mounting, automatically, LEDs on the solder cream printed parts; after mounting the LEDs, soldering the LED chips by applying heat; applying an adhesive to a base heat-dissipation plate; cutting the PI film and separating into unit product sizes; attaching the printed circuit PI film units to the adhesive by applying heat; and removing bubbles and maximizing adhesion by means of air pressure and heat.
Inventors:
LEE POONG WOO (KR)
KIM JUNG HEON (KR)
KIM JUNG HEON (KR)
Application Number:
PCT/KR2013/006114
Publication Date:
April 17, 2014
Filing Date:
July 10, 2013
Export Citation:
Assignee:
ETL CO LTD (KR)
International Classes:
F21S2/00; F21V29/00; G02F1/13357; H05K3/34
Foreign References:
| KR20110114494A | 2011-10-19 | |||
| KR20090010982A | 2009-01-30 | |||
| KR20120065273A | 2012-06-20 | |||
| KR20090112626A | 2009-10-28 |
Attorney, Agent or Firm:
CHUNG, Yongsik (KR)
정용식 (KR)
정용식 (KR)
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