Title:
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/073121
Kind Code:
A1
Abstract:
To provide a method for manufacturing a printed wiring board that is able to significantly prevent a drug solution from infiltrating into the interface between a carrier and a thin-film copper layer in a step for forming a buildup wiring layer, and that is able to significantly suppress localized rupturing in the thin-film copper layer in a coreless support separation step and defects generated due to the localized rupturing. The method of the present invention includes: a step for preparing a copper foil that has a carrier, the product of the average height Wc and the peak count Pc of the waviness curve element (Wc×Pc) on the surface on the peeling-layer side of the carrier being 20-50 μm; a step for forming a buildup wiring layer on the carrier or the thin-film copper layer to produce a laminated body having a buildup wiring layer; a step for separating the laminated body having the buildup wiring layer using a peeling layer to obtain a multilayer wiring board that includes the buildup wiring layer; and a step for processing the multilayer wiring board to obtain a printed wiring board.
Inventors:
TAKANASHI AKITOSHI (JP)
IIDA HIROTO (JP)
IIDA HIROTO (JP)
Application Number:
PCT/JP2016/071073
Publication Date:
May 04, 2017
Filing Date:
July 15, 2016
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2015040998A1 | 2015-03-26 | |||
| WO2015152380A1 | 2015-10-08 | |||
| WO2007105635A1 | 2007-09-20 |
Foreign References:
| JP2014208484A | 2014-11-06 | |||
| JP2015227502A | 2015-12-17 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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