Title:
METHOD FOR MANUFACTURING RESIN FILM-ATTACHED SINGULATED WORKPIECE PROCESSED ITEM, AND APPARATUS FOR MANUFACTURING RESIN FILM-ATTACHED SINGULATED WORKPIECE PROCESSED ITEM
Document Type and Number:
WIPO Patent Application WO/2022/210705
Kind Code:
A1
Abstract:
A method for manufacturing a resin film-attached singulated workpiece processed item (21), the method comprising performing an in-line process from a cleaving step (j) to a curing step (k), or from the curing step (k) to the cleaving step (j), the cleaving step (j) for laminating an energy-beam-curable, resin film-forming film (13) on a surface (14'b) opposite a circuit surface (14a) of a workpiece having a circuit surface or of a workpiece processed item (14') obtained by processing the workpiece, and cleaving the resin film-forming film (13), the curing step (k) for irradiating the resin film-forming film (13) with an energy beam to form a resin film (13').
Inventors:
NEMOTO TAKU (JP)
KABUTO AKIO (JP)
KABUTO AKIO (JP)
Application Number:
PCT/JP2022/015430
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/02; H01L21/301; H01L21/304
Domestic Patent References:
| WO2019009123A1 | 2019-01-10 |
Foreign References:
| JP2016219706A | 2016-12-22 | |||
| JP2007214457A | 2007-08-23 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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