Title:
METHOD FOR MANUFACTURING SEALING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2013/129307
Kind Code:
A1
Abstract:
In order to manufacture a sealing resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate at low cost and suppress mixing of air bubbles into the sealing resin sheet, in the first step, a resin body (22) in a semi-cured state is disposed in a space (26) surrounded by a pair of pressing plates (23, 25) facing each other and a side plate (24) provided on the outer peripheral side. In the second step, a vacuum is drawn into the space (26), and the resin body (22) is heated at a temperature lower than a curing temperature and extended by being pressed at a pressing speed of 0.004-0.06 mm/sec (inclusive) by the pressing plates (23, 25). Consequently, a sealing resin sheet (11) is produced.
Inventors:
KATSUBE AKIO (JP)
KITAYAMA HIROKI (JP)
IDA YUYA (JP)
WATANABE KOJI (JP)
KITAYAMA HIROKI (JP)
IDA YUYA (JP)
WATANABE KOJI (JP)
Application Number:
PCT/JP2013/054749
Publication Date:
September 06, 2013
Filing Date:
February 25, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L21/56; B29B11/12
Foreign References:
| JP2010040939A | 2010-02-18 | |||
| JP2006256195A | 2006-09-28 |
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