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Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2022/138946
Kind Code:
A1
Abstract:
The present invention pertains to a method for manufacturing a semiconductor chip, the method sequentially including steps (S1), (S2), (S3), (S3α), and (S4), and further sequentially including steps (S5) and (S6) after step (S4) (steps (S1)-(6) being defined in the description).

Inventors:
SHINODA TOMONORI (JP)
NEMOTO TAKU (JP)
TAMURA SAKURAKO (JP)
Application Number:
PCT/JP2021/048342
Publication Date:
June 30, 2022
Filing Date:
December 24, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/304; H01L21/301; H01L21/60
Domestic Patent References:
WO2020085220A12020-04-30
WO2019098329A12019-05-23
WO2021172431A12021-09-02
WO2017078055A12017-05-11
Foreign References:
JP2018067586A2018-04-26
US20150357256A12015-12-10
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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