Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING
Document Type and Number:
WIPO Patent Application WO/2024/070134
Kind Code:
A1
Abstract:
This method for manufacturing a semiconductor device includes: a step for sticking a laminate which includes a back grind tape that includes a base material and a glue layer formed on the base material, and an adhesive layer formed on the glue layer, from the adhesive layer side onto a side where an electrode of a semiconductor wafer is provided; a step for grinding and thinning the semiconductor wafer; a step for dicing the thinned semiconductor wafer and the adhesive agent layer to form individual adhesive layer-attached semiconductor chips; and a step for electrically connecting an electrode of one adhesive layer-attached semiconductor chip to an electrode of another adhesive layer-attached semiconductor chip or of a wiring circuit board, wherein the semiconductor wafer and the laminate have a circular shape in a plan view, and the diameter A of the semiconductor wafer and the diameter X of the laminate in a plan view satisfy the following equation (1). (1): A - 1.5mm ≤ X < A
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| JP2000031115 | METHOD FOR FORMING CHIP FROM WAFER |
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Inventors:
CHABANA KOICHI (JP)
SATO MAKOTO (JP)
TAZAWA TSUYOSHI (JP)
SATO MAKOTO (JP)
TAZAWA TSUYOSHI (JP)
Application Number:
PCT/JP2023/025614
Publication Date:
April 04, 2024
Filing Date:
July 11, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/301; H01L21/60
Domestic Patent References:
| WO2021171898A1 | 2021-09-02 | |||
| WO2010131575A1 | 2010-11-18 |
Foreign References:
| JP2006049482A | 2006-02-16 | |||
| JP2010056406A | 2010-03-11 | |||
| JP2010056409A | 2010-03-11 | |||
| JP2010287836A | 2010-12-24 | |||
| JP2010287848A | 2010-12-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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