Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/196296
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor device, which comprises: a step A for preparing a laminate wherein at least a sheet for temporary joint and a wiring sheet that is provided with a rewiring layer are laminated; a step B for flip-chip mounting a semiconductor chip on the wiring sheet of the laminate; a step C for preparing a sealing sheet that is obtained by plastic working of a kneaded material that is obtained by kneading an epoxy resin, a curing agent and an inorganic filler; a step D for burying the semiconductor chip into the sealing sheet by disposing the sealing sheet on the surface where the semiconductor chip is exposed; a step E for thermally curing the sealing sheet; and a step F for separating the sheet for temporary joint from the wiring sheet.
Inventors:
TOYODA EIJI (JP)
KAMEYAMA KOJIRO (JP)
MATSUMURA TAKESHI (JP)
ODA TAKASHI (JP)
KAMEYAMA KOJIRO (JP)
MATSUMURA TAKESHI (JP)
ODA TAKASHI (JP)
Application Number:
PCT/JP2014/062144
Publication Date:
December 11, 2014
Filing Date:
May 02, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/56; C07D303/27; H01L21/60; H01L23/12
Domestic Patent References:
| WO2012157665A1 | 2012-11-22 | |||
| WO2012111540A1 | 2012-08-23 |
Foreign References:
| JP2011124381A | 2011-06-23 | |||
| JP2012214743A | 2012-11-08 | |||
| JP2011219726A | 2011-11-04 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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