Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/196132
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a semiconductor device equipped with a semiconductor substrate, the method comprising: an attachment step for attaching a protective tape on a first surface of a semiconductor substrate; a first grinding step for supporting the protective tape and grinding a second surface on the side opposite to the first surface of the semiconductor substrate; a protective tape machining step for supporting the second surface of the semiconductor substrate and planarizing the protective tape; and a second grinding step for supporting the protective tape and grinding the second surface of the semiconductor substrate. In the second grinding step, in order to leave a projecting portion at the outer circumference of the semiconductor substrate, the inner side of the projecting portion may be grinded.
Inventors:
KITANO MICHIYA (JP)
Application Number:
PCT/JP2022/003409
Publication Date:
September 22, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
B24B1/00; B24B7/04; B24B49/12; H01L21/304
Domestic Patent References:
| WO2004053967A1 | 2004-06-24 |
Foreign References:
| JP2005019666A | 2005-01-20 | |||
| JP2014192204A | 2014-10-06 | |||
| JP2013012654A | 2013-01-17 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
Download PDF: