Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGING MATERIAL AND SUBSTRATE MATERIAL, SEMICONDUCTOR PACKAGING MATERIAL AND SUBSTRATE MATERIAL OBTAINED THEREBY, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/016316
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a semiconductor packaging material and a substrate material, comprising: providing a spherical or amorphous polysiloxane; performing heat treatment under a non-oxidizing gas or vacuum to obtain heat-treated powder, such that an organic group in the heat-treated powder is thermally decomposed into elemental carbon, while also condensing silicon hydroxyl groups on a surface of the heat-treated powder to form a surface dense layer; performing calcination to obtain a black spherical or amorphous silica filler; and tightly filling and grading the black spherical or amorphous silica filler in a resin to form a semiconductor packaging material and a substrate material. A semiconductor packaging material and a substrate material obtained by the manufacturing method, and an application thereof, are also provided in the present invention. The black spherical or amorphous silicon oxide filler obtained by using the manufacturing method of the present invention contains elemental carbon, and the black spherical or amorphous silicon oxide can be directly made into a gray or black semiconductor packaging material and substrate material, thereby fundamentally solving an electrical conductivity problem caused by introduction of acetylene black dye.
Inventors:
WANG KE (CN)
FANG YUANFENG (CN)
SHEN HAIBIN (CN)
CHEN SHUZHEN (CN)
FANG YUANFENG (CN)
SHEN HAIBIN (CN)
CHEN SHUZHEN (CN)
Application Number:
PCT/CN2022/110049
Publication Date:
February 16, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
ZHEJIANG THIRD AGE MATERIAL TECH CO LTD (CN)
International Classes:
C01B33/18; C08K7/18; C08K9/06; C08L83/04
Foreign References:
| CN113603103A | 2021-11-05 | |||
| CN111886201A | 2020-11-03 | |||
| CN102850593A | 2013-01-02 | |||
| CN111819248A | 2020-10-23 | |||
| CN112236393A | 2021-01-15 | |||
| CN112758940A | 2021-05-07 | |||
| JP2017197591A | 2017-11-02 |
Attorney, Agent or Firm:
SHANGHAI ZHI XIN PATENT AGENT LTD. (CN)
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