Title:
METHOD FOR MANUFACTURING SHIELD PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/047072
Kind Code:
A1
Abstract:
This method for manufacturing a shield printed wiring board includes: a step for preparing a printed wiring board body having a base substrate, a ground wiring provided on the base substrate, and an insulating layer covering the ground wiring and being provided with an opening so that a part of the ground wiring is exposed; a resist placement step for placing a resist resin in a predetermined pattern shape on the insulating layer; a metal layer formation step for providing a metal layer on the ground wiring exposed through the opening and on the printed wiring board body on which the resist resin is placed; and a step for removing the resist resin using a solvent, whereby the portion of the metal layer provided on the resist resin is removed along with the resist resin, and the metal layer present on portions other than the predetermined pattern shape is formed as a shield layer.
Inventors:
KADO KOUSUKE (JP)
HASHIMOTO KAZUHIRO (JP)
MORIMOTO SYOUHEI (JP)
TAJIMA HIROSHI (JP)
WATANABE MASAHIRO (JP)
YAMAUCHI SIROU (JP)
HASHIMOTO KAZUHIRO (JP)
MORIMOTO SYOUHEI (JP)
TAJIMA HIROSHI (JP)
WATANABE MASAHIRO (JP)
YAMAUCHI SIROU (JP)
Application Number:
PCT/JP2016/004154
Publication Date:
March 23, 2017
Filing Date:
September 13, 2016
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K3/02; H05K1/02; H05K9/00
Foreign References:
| JP2002079771A | 2002-03-19 | |||
| JP2010040547A | 2010-02-18 | |||
| JP2009016545A | 2009-01-22 | |||
| JP2006024824A | 2006-01-26 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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