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Title:
METHOD FOR MANUFACTURING SPUN THREAD BUNDLE, AND METHOD FOR MANUFACTURING CARBON FIBER IN WHICH RESULTING SPUN THREAD BUNDLE IS USED
Document Type and Number:
WIPO Patent Application WO/2016/181845
Kind Code:
A1
Abstract:
The chip resistor 1 is provided with a ceramic substrate 2 in the form of a rectangular prism, a pair of obverse electrodes 3 provided at both longitudinal end parts of the obverse surface of the ceramic substrate 2, a resistor 4 connecting the two obverse electrodes 3, a protective layer 5 covering the resistor 4, a pair of reverse electrodes 6 provided at both longitudinal end parts of the reverse surface of the ceramic substrate 2, end surface electrodes 7 for establishing conduction between the obverse electrodes 3 and the reverse electrodes 6, external electrodes 8 covering the end surface electrodes 7, and a pair of insulating resin layers 9 provided so as to cover the edge part side of the reverse electrodes 6. The insulating resin layers 9 face each other on the reverse surface of the ceramic substrate 2 across a predetermined gap, and at least the mutually facing end parts of the insulating resin layers 9 are exposed from the external electrodes 8. The ratio L/W of the distance L between the axial center of the first roller (1) and that of the pair of second rollers (2, 2') with respect to the average value of the thread width W of the carbon fiber precursor filaments on the first roller is 18 or higher, and the tension of the spun fiber bundle after the same is outputted from the fourth roller is 0.11 cN/dtex or higher.

Inventors:
ISHIO KEIICHI (JP)
AIZU KOICHI (JP)
NAKANO MASAKI (JP)
Application Number:
PCT/JP2016/063240
Publication Date:
November 17, 2016
Filing Date:
April 27, 2016
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
D01F9/32; B65H51/015
Foreign References:
JPH07216680A1995-08-15
JPH0226950A1990-01-29
JP2012154000A2012-08-16
Other References:
See also references of EP 3290549A4
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