METHOD FOR MANUFACTURING SPUTTER-COATED SUBSTRATES, MAGNETRON SOURCE AND SPUTTERING CHAMBER WITH SUCH SOURCE

Title:

METHOD FOR MANUFACTURING SPUTTER-COATED SUBSTRATES, MAGNETRON SOURCE AND SPUTTERING CHAMBER WITH SUCH SOURCE

Document Type and Number:

WIPO Patent Application WO2005088670

Kind Code:

A3

Abstract:

A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-rage magnetron magnetic field pattern which is swept along the substrate surface for improving the ion density at a substrate surface being vacuum plasma treated. The long-range field reaches the substrate surface with a component of the magnetic field parallel to the substrate surface of at least 0.1, and preferably between 1 and 20, Gauss. The plasma treating can be sputter-coating, or etching, for example.

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Inventors:

KADLEC STANISLAV (CH)
KUEGLER EDUARD (AT)
HAAG WALTER (CH)

Application Number:

PCT/CH2005/000006

Publication Date:

November 10, 2005

Filing Date:

January 06, 2005

Export Citation:

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Assignee:

UNAXIS BALZERS AG (LI)
KADLEC STANISLAV (CH)
KUEGLER EDUARD (AT)
HAAG WALTER (CH)

International Classes:

H01J37/34; (IPC1-7): H01J37/34

Domestic Patent References:

WO2004017356A2

2004-02-26

Foreign References:

US6491801B1	2002-12-10
US20040020768A1	2004-02-05
EP1067577A2	2001-01-10
US20040035692A1	2004-02-26

Other References:

W.-D. MÜNZ: "The unbalanced magnetron: current status of development", SURFACE AND COATINGS TECHNOLOGY, vol. 48, no. 1, 1 October 1991 (1991-10-01), pages 81 - 94, XP002343698

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