Title:
METHOD FOR MANUFACTURING STEPPED COPPER COLUMN IN PCB
Document Type and Number:
WIPO Patent Application WO/2016/082146
Kind Code:
A1
Abstract:
A method for manufacturing a stepped copper column (40) in PCB, wherein an electroplating-resistant ink layer (20) is fabricated on a laminate comprising a copper foil layer (11), then a first dry film layer (30) and a first copper plated layer (41) are fabricated on the electroplating-resistant ink layer after baking the electroplating-resistant ink layer at a certain temperature for a certain time, then a second dry film layer (50) and a second copper plated layer (42) are fabricated on it, so that the first dry film layer and the second dry film layer can be removed selectively in a post-process, while the electroplating-resistant ink layer remains good; after continuing electroplating of a tin layer (60) on the laminate, the unwanted copper foil layer is removed by etching, and a PCB with a stepped copper column is obtained.
Inventors:
WEI HAO (CN)
DENG JUN (CN)
AO SICHAO (CN)
LIU SONGLUN (CN)
DENG JUN (CN)
AO SICHAO (CN)
LIU SONGLUN (CN)
Application Number:
PCT/CN2014/092351
Publication Date:
June 02, 2016
Filing Date:
November 27, 2014
Export Citation:
Assignee:
JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO LTD (CN)
International Classes:
H05K1/11; H05K3/00; H05K3/46; H05K3/42
Foreign References:
| CN102523694A | 2012-06-27 | |||
| CN103208479A | 2013-07-17 | |||
| CN103731997A | 2014-04-16 | |||
| CN102291934A | 2011-12-21 | |||
| US20110265321A1 | 2011-11-03 |
Attorney, Agent or Firm:
SHENZHEN TALENT PATENT SERVICE (CN)
深圳市精英专利事务所 (CN)
深圳市精英专利事务所 (CN)
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