Title:
METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMINATED SHEET, METAL FOIL WITH RESIN, STRETCHABLE CIRCUIT BOARD, AND STRETCHABLE CIRCUIT MOUNTED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/042491
Kind Code:
A1
Abstract:
One aspect of the present invention pertains to a method for manufacturing a stretchable circuit board, the method comprising: a step (1) for preparing a fluid, a second stretchable insulation layer, and a laminate in which a metal layer and a first stretchable insulation layer are in contact, and in which the peeling strength between the metal layer and the first stretchable insulation layer is 0.5-3.0 N/mm; a step (2) for forming a via passing from a first surface (a1) of the first stretchable insulation layer that is in contact with the metal layer to a second surface (a2) opposing the first surface (a1); a step (3) for filling the via with the fluid; a step (4) for laminating the second stretchable insulation layer onto the second surface (a2) and sealing the via; and a step (5) for patterning the metal layer.
Inventors:
FUKAO TOMOHIRO
SAWADA TOMOAKI
MICHIGAMI KYOSUKE
LI QIANYING
SAWADA TOMOAKI
MICHIGAMI KYOSUKE
LI QIANYING
Application Number:
PCT/JP2022/022219
Publication Date:
March 23, 2023
Filing Date:
May 31, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K3/40; B32B3/30; B32B7/022; B32B15/08; B32B15/092; H05K1/02
Domestic Patent References:
| WO2018123732A1 | 2018-07-05 |
Foreign References:
| US20200008307A1 | 2020-01-02 | |||
| CN212010395U | 2020-11-24 | |||
| US20160274408A1 | 2016-09-22 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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