Title:
METHOD FOR MANUFACTURING SUBSTRATE PROVIDED WITH MULTILAYER REFLECTION FILM, METHOD FOR MANUFACTURING REFLECTIVE MASK BLANK, AND METHOD FOR MANUFACTURING REFLECTIVE MASK
Document Type and Number:
WIPO Patent Application WO/2013/146488
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a substrate that is provided with a multilayer reflection film, said substrate having the multilayer reflection film formed on the main surface thereof. This method for manufacturing a substrate that is provided with a multilayer reflection film for EUV lithography has: a multilayer reflection film forming step wherein the multilayer reflection film is formed on the main surface of the substrate such that a film thickness reducing region is formed at the circumferential end portion of the main surface, said film thickness reducing region having the film thickness thereof reduced toward the outer side of the substrate from the inner side thereof; and a reference mark forming step wherein a reference mark to be defect position reference in the defect information of the substrate surface that is provided with the multilayer reflection film is formed in the film thickness reducing region by removing at least a part of the multilayer reflection film.
Inventors:
SHOKI TSUTOMU (JP)
HAMAMOTO KAZUHIRO (JP)
HAMAMOTO KAZUHIRO (JP)
Application Number:
PCT/JP2013/057950
Publication Date:
October 03, 2013
Filing Date:
March 21, 2013
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
H01L21/027; G03F1/24
Foreign References:
| JP2012009833A | 2012-01-12 | |||
| JP2002217097A | 2002-08-02 | |||
| JP2011077480A | 2011-04-14 | |||
| JP2005077845A | 2005-03-24 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
Patent business corporation Tsukuni (JP)
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