Title:
METHOD FOR MANUFACTURING SURFACE-TREATED COPPER FINE PARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/069635
Kind Code:
A1
Abstract:
Provided is a method for manufacturing low-temperature-sinterable surface-treated copper fine particles, including a step for mixing an aqueous solution including copper fine particles having a BET specific surface area of 0.1-10.0 m2/g and a nonionic surfactant, wherein novel surface-treated copper fine particles suitable for use in a paste that is usable in a low-temperature region are manufactured by surface treatment by mixing with the aqueous solution, by a manufacturing method in which the nonionic surfactant has an ethylene oxide chain and an HLB value of 9 to 18 determined by Griffin's method.
Inventors:
FURUSAWA HIDEKI (JP)
KUMAGAI MASASHI (JP)
KUMAGAI MASASHI (JP)
Application Number:
PCT/JP2018/033498
Publication Date:
April 11, 2019
Filing Date:
September 10, 2018
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B22F1/102
Foreign References:
| JP2001089803A | 2001-04-03 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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