Title:
METHOD FOR MANUFACTURING THIN FILM-EQUIPPED SUBSTRATE, THIN FILM-EQUIPPED SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER REFLECTIVE FILM-EQUIPPED SUBSTRATE, MULTILAYER REFLECTIVE FILM-EQUIPPED SUBSTRATE, REFLECTIVE MASK BLANK, METHOD FOR MANUFACTURING REFLECTIVE MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004843
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a thin film-equipped substrate, the method making it possible to detect an identification mark when performing a defect inspection on the thin film-equipped substrate, and easily performing an individual identification of the thin film-equipped substrate and an association between defect information of a thin film and the identification mark. When a defect inspection is performed on a thin film-equipped substrate that includes a substrate and a thin film formed on the substrate, and has an identification mark unique to the thin film-equipped substrate in a region having no influence on pattern transfer of a surface on the side where the thin film is formed of the thin film-equipped substrate, defect information of the thin film and the identification mark are detected. Consequently, an individual identification of the thin film-equipped substrate and an association between the detected defect information of the thin film and the identification mark are performed.
Inventors:
IWAMOTO KENTARO (JP)
SHOKI TSUTOMU (JP)
TSUKAGOSHI KENTA (JP)
HASHIMOTO MASAHIRO (JP)
SHOKI TSUTOMU (JP)
TSUKAGOSHI KENTA (JP)
HASHIMOTO MASAHIRO (JP)
Application Number:
PCT/JP2023/023270
Publication Date:
January 04, 2024
Filing Date:
June 23, 2023
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
G03F1/24; G03F1/84
Domestic Patent References:
| WO2010061725A1 | 2010-06-03 |
Foreign References:
| JP2018072801A | 2018-05-10 | |||
| JP2009253124A | 2009-10-29 | |||
| JP2006309143A | 2006-11-09 |
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
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