Title:
METHOD FOR MANUFACTURING TRANSPARENT ELECTROCONDUCTIVE SUBSTRATE, AND TRANSPARENT ELECTROCONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/221183
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a transparent electroconductive substrate having a patterning process for patterning a laminate which is a constituent of a laminated substrate that includes a transparent substrate and the laminate arranged on at least one side of the transparent substrate and consisting of a first blackening layer containing nickel and copper and an electroconductive layer containing copper that are laminated in the order stated from the transparent substrate side, the patterning process having an electroconductive layer etching step for etching the electroconductive layer with a first etchant with which copper can be dissolved, and a first blackening layer etching step for etching the first blackening layer with a second etchant containing chloride icons and water, the chloride ion concentration of the second etchant being 10 mass% or more in terms of hydrochloric acid.
Inventors:
SHIMOJI TAKUMI (JP)
Application Number:
PCT/JP2018/018559
Publication Date:
December 06, 2018
Filing Date:
May 14, 2018
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
G06F3/041; B32B7/02; B32B15/08; G06F3/044
Foreign References:
| JP2017064939A | 2017-04-06 | |||
| JP2015138820A | 2015-07-30 | |||
| JP2015007271A | 2015-01-15 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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