Title:
METHOD FOR MANUFACTURING VERTICAL RESONATOR-TYPE SURFACE-EMITTING LASER ELEMENT, VERTICAL RESONATOR-TYPE SURFACE-EMITTING LASER ELEMENT, DISTANCE SENSOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/116721
Kind Code:
A1
Abstract:
[Problem] To provide: a method for manufacturing a vertical resonator-type surface-emitting laser element exhibiting excellent conductivity/heat-dissipation; the vertical resonator-type surface-emitting laser element; a distance sensor; and an electronic device. [Solution] In the method for manufacturing a vertical resonator-type surface-emitting laser element according to the present technology: a first substrate is created by sequentially stacking a dielectric DBR layer and a first dielectric to-be-bonded layer on a support substrate; a second substrate is created by sequentially stacking a semiconductor DBR layer, an electric current constriction layer, an active layer, a contact layer, and a second dielectric to-be-bonded layer on a semiconductor substrate; the dielectric to-be-bonded layers are bonded together; and a bonded body of the first substrate and the second substrate is annealed.
Inventors:
KIMURA HIDEKI (JP)
Application Number:
PCT/JP2018/038870
Publication Date:
June 20, 2019
Filing Date:
October 18, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01S5/183
Foreign References:
| JP2015103783A | 2015-06-04 | |||
| JP2011205076A | 2011-10-13 | |||
| JP2004207536A | 2004-07-22 | |||
| JP2017508280A | 2017-03-23 | |||
| US20120213243A1 | 2012-08-23 |
Other References:
EMANUEL P. HAGLUND. ET AL.: "Silicon-integrated hybrid- cavity 850-nm VCSELs by adhesive bonding: Impact of bonding interface thickness on laser Performance", IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 23, no. 6, 16 January 2017 (2017-01-16), pages 1 - 9, XP055618957
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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