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Patent Searching and Data


Title:
METHOD OF MANUFACTURING WAVEGUIDE, AND WAVEGUIDE
Document Type and Number:
WIPO Patent Application WO/2003/005482
Kind Code:
A1
Abstract:
A method of manufacturing a waveguide, comprising the steps of forming through holes (25) in the flange parts (23) of a pair of waveguide units (20) and (21), connecting the pair of waveguide units (20) and (21) having the through holes (25) formed therein, and insert−forming the pair of connected waveguide units (20) and (21) with thermoplastic resin to form an external resin part (30) filled into the through holes (25) and covering the pair of waveguide units (20) and (21), whereby, since the pair of waveguide units are connected to each other by utilizing resin formation, a workability for assembly, a tightening force between the units, and the air−tightness of the waveguides can be increased.

Inventors:
MUKUDA MUNEAKI (JP)
INUZUKA TAKAYUKI (JP)
YAMADA NAOSI (JP)
ASAO HIDEKI (JP)
HENMI KAZUHISA (JP)
Application Number:
PCT/JP2002/005742
Publication Date:
January 16, 2003
Filing Date:
June 10, 2002
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MUKUDA MUNEAKI (JP)
INUZUKA TAKAYUKI (JP)
YAMADA NAOSI (JP)
ASAO HIDEKI (JP)
HENMI KAZUHISA (JP)
International Classes:
H01P3/12; H01P11/00; (IPC1-7): H01P11/00; H01P3/12
Foreign References:
US5398010A1995-03-14
US5380386A1995-01-10
JP2001053509A2001-02-23
JPH07326910A1995-12-12
JPS5772602U1982-05-04
Attorney, Agent or Firm:
Sakai, Hiroaki (2-6 Kasumigaseki 3-chom, Chiyoda-ku Tokyo, JP)
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