Title:
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/264756
Kind Code:
A1
Abstract:
This method for manufacturing a wiring circuit board 1 includes: a first step for setting a pattern forming area A11 and an opening forming area A12 on a support layer 11; a second step for forming a base insulating layer 12 on the support layer 11 at least in the pattern forming area A11; a third step for forming, by electroplating, a conductor pattern 13 on the base insulating layer 12 in the pattern forming area A11 and a dummy pattern 22 in the opening forming area A12; and a fourth step for etching at least a part of the support layer 11 in the opening forming area A12.
Inventors:
TAKAKURA HAYATO (JP)
SHIBATA NAOKI (JP)
FUKUI REI (JP)
TANAKA TOMOAKI (JP)
SHIBATA NAOKI (JP)
FUKUI REI (JP)
TANAKA TOMOAKI (JP)
Application Number:
PCT/JP2022/021222
Publication Date:
December 22, 2022
Filing Date:
May 24, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K3/18; H05K3/00
Foreign References:
| JP2012038914A | 2012-02-23 | |||
| JP2010147251A | 2010-07-01 | |||
| JP2021050389A | 2021-04-01 | |||
| JP2003273498A | 2003-09-26 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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