METHOD OF METALLIC COMPONENT SURFACE MOODIFICATION FOR ELECTROCHEMICAL APPLICATIONS

WIPO Patent Application WO/2016/168649

A3

Method for forming a metallic component surface to achieve lower electrical contact resistance. The method comprises modifying a surface chemical composition and creating a micro-textured surface structure of the metallic component that includes small peaks and/or pits. The small peaks and pits have a round or irregular cross-sectional shape with a diameter between 10 nm and 10 microns, a height/depth between 10 nm and 10 microns, and a distribution density between 0.4 million/ cm2 and 5 billion cm2.

JPH05287498	PRETREATMENT OF BAND PLATE FOR VAPOR DEPOSITION TREATMENT AND DEVICE THEREFOR
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WO/2022/240357	DYSPROSIUM SCANDATE FILMS, METHODS OF FABRICATION AND USES THEREOF

WANG CONGHUA (US)
TAO YONG (US)
ZHANG LIN (US)
GONTARZ GERALD A (US)

PCT/US2016/027827

November 24, 2016

April 15, 2016

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TREADSTONE TECH INC (US)

C23C14/02; C23C8/02; C23C10/02; C23C14/04; C23C14/06; C23C14/22

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See also references of EP 3283665A4

MINUTOLI, Gianni et al. (P.O. Box 2758Reston, VA, US)

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