Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MODELING FLOW STRESS FORMULA OF MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/018004
Kind Code:
A1
Abstract:
A method for modeling a flow stress formula of the present invention may comprise the step of fitting a flow stress curve of a specimen by a flow stress formula model, and the flow stress formula model may be an extended piecewise bilinear model. The flow stress according to the flow stress formula model may be proportional to the second variable, the exponential power of a strain rate which is a variation in strain with respect to time, and the coefficient of proportionality may be a first variable.

Inventors:
KIM MIN CHEOL (KR)
EOM JAE GUN (KR)
CHUNG SUK HWAN (KR)
Application Number:
PCT/KR2022/009278
Publication Date:
February 16, 2023
Filing Date:
June 29, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MFRC CO LTD (KR)
International Classes:
G06F30/20; G01N11/08; G06F111/10; G06F119/14
Foreign References:
JP2008051768A2008-03-06
JP2009197091A2009-09-03
KR100948035B12010-03-19
Other References:
SHIN, HYUNHO, KIM, JONG-BONG: "Description Capability of a Simple Phenomenological Constitutive Model for High-Strain-Rate Plasticity Data.", PROCEEDINGS OF THE KOREAN SOCIETY FOR TECHNOLOGY OF PLASTICITY CONFERENCE, vol. 2009, pages 190 - 193, XP093035774, Retrieved from the Internet [retrieved on 20230329]
LEE, KI-SEOK: "Characterization of superplastic material SPF8090 AI-Li with the variation of the strain rate and the temperature", JOURNAL OF THE KOREAN SOCIETY FOR TECHNOLOGY OF PLASTICITY., vol. 6, no. 5, 1 January 1997 (1997-01-01), pages 425 - 434, XP093036988
Attorney, Agent or Firm:
TW INTERNATIONAL PATENT AND LAWFIRM (KR)
Download PDF: