Title:
METHOD FOR MODELING WAFER SHAPE, AND METHOD FOR MANUFACTURING WAFER
Document Type and Number:
WIPO Patent Application WO/2024/062741
Kind Code:
A1
Abstract:
Provided is a method for modeling a wafer shape by means of a function. The function calculates a displacement z of a wafer in the thickness direction thereof, and is the sum of a plurality of functions including: a first function g(r) that is a polynomial of one or more orders and has a distance r from the center of the wafer as a variable; a second function Ar×h(Nθ) in which a sine function or a cosine function h(Nθ) having a first angle θ with reference to a predetermined position in the circumferential direction of the wafer as a variable and an integer N as a constant is multiplied by a coefficient A and the distance r; and a third function Br×i(M(θ-φ)) in which a sine function or a cosine function i(M(θ-φ)) having the first angle θ as a variable and a second angle φ with reference to the predetermined position and an integer M as constants is multiplied by a coefficient B and the distance r.
Inventors:
MURAKAMI MASAHIRO (JP)
Application Number:
PCT/JP2023/025565
Publication Date:
March 28, 2024
Filing Date:
July 11, 2023
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
H01L21/66; H01L21/304
Foreign References:
| JP2020038920A | 2020-03-12 | |||
| JP2019067952A | 2019-04-25 | |||
| JP2014017381A | 2014-01-30 | |||
| JPH05235133A | 1993-09-10 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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