Title:
METHOD FOR MOLDING FLUORINE RESIN MOLDED ARTICLE, METHOD FOR PRODUCING MEDICAL DIAPHRAGM, AND METHOD FOR PRODUCING SEMICONDUCTOR DIAPHRAGM
Document Type and Number:
WIPO Patent Application WO/2020/017106
Kind Code:
A1
Abstract:
Provided is a method for molding a fluorine resin molded article which makes it possible to mold a fluorine resin molded article, the properties of which differ by section thereof, as a single molded article. A method for molding a fluorine resin molded article which involves molding the fluorine resin molded article by molding a preform by applying pressure to a fluorine resin powder using a primary molding die 100, filling a secondary molding die with the preform after baking is completed, and cooling the same in a state where pressure is applied thereto, wherein the molding of the preform is performed by filling the primary molding die 100 with a layered body 10 obtained by layering at least two types of fluorine resin powder which exhibit different average particle diameters from one another.
Inventors:
HIGUCHI JUNICHI (JP)
Application Number:
PCT/JP2019/014515
Publication Date:
January 23, 2020
Filing Date:
April 01, 2019
Export Citation:
Assignee:
JAPAN SEAL IZUMI CO LTD (JP)
International Classes:
B29C43/18; B29B11/12; B29C43/36; B29C43/52; B29C67/04; F16J3/02; B29K27/12
Domestic Patent References:
| WO2008069196A1 | 2008-06-12 |
Foreign References:
| JPH0510444A | 1993-01-19 | |||
| JP2003311763A | 2003-11-05 | |||
| JP2007320267A | 2007-12-13 | |||
| JPH0510444A | 1993-01-19 |
Other References:
See also references of EP 3825089A4
Attorney, Agent or Firm:
OKINAKA Jin (JP)
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