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Patent Searching and Data


Title:
METHOD FOR MOLDING PIEZOELECTRIC POLYMER AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2014/087914
Kind Code:
A1
Abstract:
Provided is a molding method which is capable of molding a piezoelectric polymer into polymer piezoelectric materials having various shapes. Also provided are: a vibration generator which uses a polymer piezoelectric material; and a speaker which is provided with the vibration generator and is capable of generating a high sound pressure, while achieving flat sound pressure-frequency characteristics. A material formed from a piezoelectric polymer is molded at a temperature that is not less than the glass transition temperature but less than the crystallization temperature of the piezoelectric polymer, and then the material is heat-treated at a temperature that is not less than the crystallization temperature of the piezoelectric polymer. With respect to a vibration generator which comprises a piezoelectric region formed from a piezoelectric polymer, a first electrode that is disposed on a first main surface of the piezoelectric region and a second electrode that is disposed on a second main surface of the piezoelectric region, the piezoelectric modulus is set to 1 pC/N or more, and (a) the ratio of the length in the longitudinal direction to the thickness of the piezoelectric region is set to about 100 or more, (b) the ratio of the curvature radius of a curved portion to the thickness of the piezoelectric region is set to about 10 or more, or (c) the ratio of the length in the longitudinal direction to the curvature radius of the curved portion of the piezoelectric region is set to about 0.01 or more.

Inventors:
TAJITSU YOSHIRO (JP)
KARASAWA YASUYUKI (JP)
Application Number:
PCT/JP2013/082031
Publication Date:
June 12, 2014
Filing Date:
November 28, 2013
Export Citation:
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Assignee:
SCHOOL CORP KANSAI UNIV (JP)
International Classes:
H04R17/00; B06B1/06; C08J5/00; C08J7/00; H01L41/193; H01L41/45; H04R7/12; H04R31/00
Domestic Patent References:
WO2010104196A12010-09-16
WO2009139237A12009-11-19
Foreign References:
JP2008063502A2008-03-21
JPH05212781A1993-08-24
JP2011082931A2011-04-21
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
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