Title:
METHOD FOR MOUNTING DIE
Document Type and Number:
WIPO Patent Application WO/2017/209115
Kind Code:
A1
Abstract:
A method for mounting a die includes: a step for preparing a die 100 having a bump formation surface 102a on which a plurality of bump electrodes 106 are formed; a step for disposing a vacuum suction tool 22 having a suction surface 24 above the die 100 in an orientation such that the suction surface 24 faces the bump formation surface 102a; a step for sandwiching a porous sheet 44 between the suction surface 24 and the bump formation surface 102a and suctioning the die 100 with the vacuum suction tool 22; and a step for mounting the die 100 that was suctioned with the vacuum suction tool 22 in a bonding region of a substrate 110 with an adhesive material 114 interposed therebetween, the porous sheet 44 having a thickness equal to or greater than the protrusion height of the bump electrodes 106 on the bump formation surface 102a. Stabilization and ease of maintenance of vacuum suction can thereby be improved.
Inventors:
WATANABE OSAMU (JP)
NAKAMURA TOMONORI (JP)
HAGIWARA YOSHIHITO (JP)
NAKAMURA TOMONORI (JP)
HAGIWARA YOSHIHITO (JP)
Application Number:
PCT/JP2017/020054
Publication Date:
December 07, 2017
Filing Date:
May 30, 2017
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/52; H01L21/60; H05K13/04
Domestic Patent References:
| WO2016125764A1 | 2016-08-11 |
Foreign References:
| JP2003218590A | 2003-07-31 | |||
| JP2004128339A | 2004-04-22 | |||
| JP2001053113A | 2001-02-23 | |||
| JP2006066767A | 2006-03-09 | |||
| JPH05190665A | 1993-07-30 | |||
| JP2015170690A | 2015-09-28 | |||
| JP2002134564A | 2002-05-10 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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