METHOD OF MOUNTING ELECTRONIC PART - MATSUSHITA ELECTRIC IND CO LTD

Title:

METHOD OF MOUNTING ELECTRONIC PART

Document Type and Number:

WIPO Patent Application WO/1984/000464

Kind Code:

A1

Abstract:

Method of mounting an electronic part, which comprises the steps of coating a two-liquid adhesive (12) composed of a main agent and a separate curing accelerator using a dispenser containing a mixture (2) of the main agent and the curing accelerator on the area of a printed circuit board (10) where the part is to be placed, placing the electronic part (13) on the area coated with the adhesive (12), thereafter heating or shining ultra-violet light thereon to cure the adhesive (12), thereby temporarily securing the part (13), and then soldering the part on. This enables the mounting of large-sized electronic parts.

More Like This:

JP4144772	Specimen container for testing
JP6907183	Methods and equipment for sample separation and collection

Inventors:

HOHCHIN RYUZOH (JP)
KUDOH SHINICHI (JP)
MAEDA YUKIO (JP)

Application Number:

PCT/JP1982/000264

Publication Date:

February 02, 1984

Filing Date:

July 13, 1982

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)

International Classes:

G01N33/48; C09J5/06; G01N27/447; H05K3/30; (IPC1-7): H05K3/34; C09J3/14

Foreign References:

JPS5685896A	1981-07-13
JPS5716083A	1982-01-27

Other References: