Title:
METHOD FOR OPERATING VACUUM PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/161873
Kind Code:
A1
Abstract:
Provided is a technique which pertains to a method for operating a vacuum processing device and with which effective transportation and processing can be achieved in processing a plurality of steps when the vacuum processing device is a link type vacuum processing device. A method for operating a vacuum processing device according to an embodiment has a first step (steps 601-607) for selecting a single first processing unit and a single second processing unit among a plurality of processing units with regard to each of wafers so as to minimize the time required for processing all the plurality of wafers in a plurality of processing steps, and determining a transport schedule including a transportation path for using the selected processing units. In the first step, the transportation schedule including the transport path is constructed for at least a single wafer, by using the first processing unit selected excluding at least a single first processing unit from the plurality of first processing units. This operation method selects an optimal transportation schedule when the second step is rate-controlled.
Inventors:
SAIGOU YOSHIKAZU (JP)
SUEMITSU YOSHIRO (JP)
ISHIKAWA HIROYUKI (JP)
SUEMITSU YOSHIRO (JP)
ISHIKAWA HIROYUKI (JP)
Application Number:
PCT/JP2019/004511
Publication Date:
August 13, 2020
Filing Date:
February 07, 2019
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
H01L21/677; B65G49/07
Foreign References:
| JP2013098412A | 2013-05-20 | |||
| JP2000150619A | 2000-05-30 | |||
| JPH08316119A | 1996-11-29 | |||
| JPH11251399A | 1999-09-17 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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