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Patent Searching and Data


Title:
METHOD FOR POLISHING LARGE-SIZE SINGLE CRYSTAL DIAMOND
Document Type and Number:
WIPO Patent Application WO/2021/078237
Kind Code:
A1
Abstract:
Disclosed is a method for polishing a large-size single crystal diamond. When carbon atoms of a surface layer of the large-size diamond undergo the mechanical shearing action of a hard abrasive, lattice distortion occurs to produce an amorphous carbon layer, and subsequently, since a local high temperature is generated between abrasive grains and the diamond under high-speed friction, a chemical reaction occurs between the reactive abrasive grains and the amorphous carbon on the surface of the diamond, so as to achieve the aim of rapidly removing the carbon atoms from the surface layer of the diamond. This method can achieve efficient ultra-precision polishing of the diamond and a nano-scale surface roughness, without causing damage to the surface of the diamond. This flexible polishing method is suitable for ultra-precision polishing of the large-size single crystal diamond.

Inventors:
LU JING (CN)
XU XIPENG (CN)
WANG YANHUI (CN)
LUO QIUFA (CN)
XIAO PING (CN)
Application Number:
PCT/CN2020/123118
Publication Date:
April 29, 2021
Filing Date:
October 23, 2020
Export Citation:
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Assignee:
UNIV HUAQIAO (CN)
International Classes:
B24B29/02; B24B1/00
Attorney, Agent or Firm:
SHOUCHUANG JUNHE PATENT AGENT CO., LTD.XIAMEN (CN)
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