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Title:
METHOD FOR PREDICTING GENERATED AMOUNT OF SILICA SCALE
Document Type and Number:
WIPO Patent Application WO/2023/074697
Kind Code:
A1
Abstract:
The present invention accurately predicts a generated amount of silica scale under complicated conditions. A method for predicting a generated amount of silica scale comprises: a step for acquiring a temperature Ts(K) at a prediction portion at which the adhesion of the silica scale should be predicted, and/or a time ts(min.) until a fluid including silicic acid reaches the prediction portion; and a step for computing an adhesion amount of the silica at the prediction portion on the basis of a prediction equation of silica saturation concentration dependent on the temperature, and/or a prediction curve of silica dissolved concentration dependent on the time, wherein the prediction equation of the silica saturation concentration and the prediction curve of the silica dissolved concentration are obtained on the basis of k1, k2, kB, ka in a three-step precipitation equilibrium reaction model that is expressed as the following formula (1).

Inventors:
JIANG TIANLONG (JP)
HIROSE TAKAYUKI (JP)
WADA AZUSA (JP)
UI SHINYA (JP)
Application Number:
PCT/JP2022/039764
Publication Date:
May 04, 2023
Filing Date:
October 25, 2022
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
G01N25/18; C02F5/00; F03G4/00
Domestic Patent References:
WO2019202981A12019-10-24
WO2012144277A12012-10-26
Foreign References:
JP2002257030A2002-09-11
JPH07146263A1995-06-06
JP2004132636A2004-04-30
JP2015124991A2015-07-06
JPH08285211A1996-11-01
JP2016166781A2016-09-15
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
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