Title:
METHOD FOR PREPARING ALLOY FOR DIFFUSION BONDING, AND DIFFUSION BONDING MATERIAL PRODUCED USING METHOD FOR PREPARING ALLOY FOR DIFFUSION BONDING
Document Type and Number:
WIPO Patent Application WO/2024/053982
Kind Code:
A1
Abstract:
The present invention relates to a method for preparing an alloy for diffusion bonding, comprising a matrix and an alloyed region having a different chemical composition from the matrix, and the method may comprise: (a) an application step of forming an alloy precursor layer containing nickel (Ni) on the surface of a base material; (b) a surface alloying step of forming an alloyed region by mixing the base material and constituent elements of the alloy precursor layer; and (c) a polishing step of preparing an alloy surface for diffusion bonding by removing at least a portion of the alloyed region.
Inventors:
HWANG JONG BAE (KR)
SAH INJIN (KR)
KIM EUNG SEON (KR)
SAH INJIN (KR)
KIM EUNG SEON (KR)
Application Number:
PCT/KR2023/013216
Publication Date:
March 14, 2024
Filing Date:
September 05, 2023
Export Citation:
Assignee:
KOREA ATOMIC ENERGY RES (KR)
International Classes:
B23K20/00; C23C26/00
Foreign References:
| KR101527112B1 | 2015-06-08 | |||
| KR102261029B1 | 2021-06-04 | |||
| KR20120084312A | 2012-07-27 | |||
| KR20210010994A | 2021-01-29 | |||
| JP2017121633A | 2017-07-13 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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