Title:
METHOD FOR PREPARING CHIP ON FILM (COF)
Document Type and Number:
WIPO Patent Application WO/2010/058937
Kind Code:
A2
Abstract:
The present invention relates to a method for preparing a chip on film (COF). The method comprises the steps of: molding a film with high releasability and strong heat resistance in intaglio using a roller mold; filling only an intaglio part of the film with conductive materials using a mask; forming a coating layer on the surface of the film filled with the conductive materials; thermally fusing a polyimide resin on the surface of the film; and forming circuits by separating the thermally fused polyimide resin from the film and then transferring the conductive materials and the coating layer to the polyimide resin. Therefore, the invention is environmentally friendly by producing a chip on film (COF) without an etching process and has high productivity and excellent adhesive force by producing the chip on film through a roll-to-roll method. In addition, the invention can implement extremely fine patterns which have not been achieved by an etching process.
Inventors:
KIM JUNG SIK (KR)
HWANG CHOON SEOB (KR)
HWANG CHOON SEOB (KR)
Application Number:
PCT/KR2009/006746
Publication Date:
May 27, 2010
Filing Date:
November 17, 2009
Export Citation:
Assignee:
KIM JUNG SIK (KR)
HWANG CHOON SEOB (KR)
HWANG CHOON SEOB (KR)
International Classes:
B29C39/14; B29C59/04
Foreign References:
| JP2008073902A | 2008-04-03 | |||
| KR20060097578A | 2006-09-14 | |||
| KR20060108144A | 2006-10-17 | |||
| KR20040056902A | 2004-07-01 |
Attorney, Agent or Firm:
SEONG, NAK HOON (KR)
성낙훈 (KR)
성낙훈 (KR)
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