Title:
METHOD FOR PREPARING LAMINATION PLAN
Document Type and Number:
WIPO Patent Application WO/2022/176578
Kind Code:
A1
Abstract:
This method for preparing a lamination plan for a lamination molded article comprises: a step for acquiring shape data; a step for determining a weld path for each layer obtained by breaking down the three dimensional shape of a lamination molded article into layers; a step for classifying each of a plurality of the weld paths into a crossing region path or a constant region path; a step for dividing the crossing region paths into lower-layer paths and upper-layer paths of a crossing portion; and a step for determining welding conditions for the crossing region paths so that an upper-layer deposition amount becomes greater than a lower-layer deposition amount while making the sum of the upper-layer deposition amount and the lower-layer deposition amount equal to the deposition amount obtained in the constant region paths, and that, in a cross-section perpendicular to the longitudinal direction of weld beads obtained in the upper-layer paths, the respective profiles of mutually adjacent weld beads would overlap with each other.
Inventors:
HUANG SHUO
Application Number:
PCT/JP2022/003449
Publication Date:
August 25, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
B23K26/342; B23K9/032; B23K9/04; B23K9/12; B33Y10/00; B33Y30/00; B33Y50/02
Domestic Patent References:
WO2020250446A1 | 2020-12-17 | |||
WO2021064952A1 | 2021-04-08 |
Foreign References:
JP2021016879A | 2021-02-15 | |||
JP2017227977A | 2017-12-28 | |||
JP2010201474A | 2010-09-16 | |||
JP2019111582A | 2019-07-11 | |||
JP2021025576A | 2021-02-22 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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