Title:
METHOD FOR PREPARING LOW DIELECTRIC HOLLOW SILICA MICROSPHERE
Document Type and Number:
WIPO Patent Application WO/2021/253727
Kind Code:
A1
Abstract:
A method for preparing a low dielectric hollow silica microsphere. In the method, polystyrene is used as a template of the hollow microsphere, and a cationic comonomer, i.e. acryloyloxyethyl trimethyl ammonium chloride (DAC) is added to introduce positively charged groups into polymer chains so as to prepare positively charged polystyrene spheres. The present method does not need to add an activator, so that the surface of the spheres can be positively charged by itself to attract a silicon source to be uniformly coated on the template. By means of this calcination method, a dense spherical structure can be obtained. The microsphere prepared by the template method for preparing a silica microsphere has a high conglomeration rate, is dense and difficult to break, and has a low dielectric constant and an improved substrate modulus and heat resistance, making it particularly suitable for the needs of the copper clad plate industry.
Inventors:
YIN YALING (CN)
ZHENG HAITAO (CN)
SHEN XIAOYAN (CN)
ZHENG HAITAO (CN)
SHEN XIAOYAN (CN)
Application Number:
PCT/CN2020/131907
Publication Date:
December 23, 2021
Filing Date:
November 26, 2020
Export Citation:
Assignee:
SUZHOU GINET NEW MATERIAL TECH CO LTD (CN)
International Classes:
C01B33/12; C01B33/18
Foreign References:
| CN101125955A | 2008-02-20 | |||
| CN107128935A | 2017-09-05 | |||
| CN102009981A | 2011-04-13 | |||
| CN107964203A | 2018-04-27 | |||
| CN105502420A | 2016-04-20 | |||
| CN109626381A | 2019-04-16 | |||
| US20070036705A1 | 2007-02-15 |
Attorney, Agent or Firm:
CHANGZHOU BAIYETENGFEI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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