Title:
METHOD FOR PROCESSING OBJECT TO BE PROCESSED, PROCESSING LIQUID, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048382
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for processing an object to be processed, said method exhibiting an excellent etching amount with respect to a metal layer including at least one metal selected from the group consisting of molybdenum and tungsten and also achieving excellent flatness of a metal layer surface after processing. A method for processing an object to be processed in accordance with the present invention comprises: a step 1 for forming a metal oxidation layer by bringing into contact a first processing liquid and an object to be processed which has a metal layer including at least one metal selected from the group consisting of molybdenum and tungsten; and a step 2 for removing the metal oxidation layer by bringing into contact a second processing liquid and the object to be processed which includes the metal oxidation layer, wherein the first processing liquid contains an organic solvent and an oxidizer, and the second processing liquid contains water.
Inventors:
MIZUTANI ATSUSHI (JP)
NARITA MOE (JP)
OI SHOTA (JP)
NARITA MOE (JP)
OI SHOTA (JP)
Application Number:
PCT/JP2023/030247
Publication Date:
March 07, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/308; C23F1/26; C23F1/38; H01L21/304; H01L21/306
Domestic Patent References:
| WO2022149565A1 | 2022-07-14 | |||
| WO2005019499A1 | 2005-03-03 |
Foreign References:
| JP2016127065A | 2016-07-11 | |||
| JP2012222066A | 2012-11-12 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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