METHOD FOR PROCESSING SAW RESIDUE FROM THE PRODUCTION OF SILICON WAFERS

Title:

METHOD FOR PROCESSING SAW RESIDUE FROM THE PRODUCTION OF SILICON WAFERS

Document Type and Number:

WIPO Patent Application WO/2011/051334

Kind Code:

A3

Abstract:

The invention relates to a method for processing saw residue from the production of silicon wafers, comprising the following steps: a) mixing the saw residue from the production of silicon wafers comprising fine-grained silicon and fine-grained silicon carbide with hydrofluoric acid, b) filtering the reaction mixture from step a) mixed with a solvent, c) drying the filter residue, and d) flushing hydrogen chloride through the solid mixture obtained from step c). The invention further relates to the use of the method product for producing high-purity silicon blocks for wafer production.

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Inventors:

PIKHARD OLIVER (DE)
SCHOLZ MARCO (DE)
MELIN THOMAS (NL)

Application Number:

PCT/EP2010/066255

Publication Date:

July 07, 2011

Filing Date:

October 27, 2010

Export Citation:

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Assignee:

RWTH AACHEN (DE)
PIKHARD OLIVER (DE)
SCHOLZ MARCO (DE)
MELIN THOMAS (NL)

International Classes:

C01B33/027; C01B33/107

Domestic Patent References:

WO2010017231A1	2010-02-11
WO2008133525A1	2008-11-06
WO2001042136A1	2001-06-14

Foreign References:

EP1942077A1

2008-07-09

Attorney, Agent or Firm:

MICHALSKI HÜTTERMANN & PARTNER PATENTANWÄLTE (Düsseldorf, DE)

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