Title:
METHOD FOR PROCESSING SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2022/244794
Kind Code:
A1
Abstract:
This method for processing a semiconductor wafer comprises: a step in which a semiconductor wafer comprising a body section and a rim section having a protruding section with a greater thickness than the body section is prepared; a step in which dicing tape is affixed to a second surface of the semiconductor wafer and the semiconductor wafer is supported; a step in which the semiconductor wafer supported by the dicing tape is installed in a stage section of a base; and a step in which the body section and the rim section are separated by cutting the peripheral edge of the body section while the body section is supported by the stage section. The step in which the semiconductor wafer is installed on the base includes a step in which the semiconductor wafer is installed on the base so that the body section is supported by the stage section while the protruding section is separated from the surface of the base 41.
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Inventors:
YAMADA RYOSUKE (JP)
NAKAO YUICHI (JP)
NAKAO YUICHI (JP)
Application Number:
PCT/JP2022/020625
Publication Date:
November 24, 2022
Filing Date:
May 18, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
B24B41/06; H01L21/301
Foreign References:
| JP2014207386A | 2014-10-30 | |||
| JP2008227521A | 2008-09-25 | |||
| JP2010016146A | 2010-01-21 | |||
| JP2016187004A | 2016-10-27 | |||
| JP2013098248A | 2013-05-20 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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