Title:
METHOD FOR PROCESSING SUBSTRATE, CHEMICAL SOLUTION, AND METHOD FOR PROVIDING CHEMICAL SOLUTION
Document Type and Number:
WIPO Patent Application WO/2023/054055
Kind Code:
A1
Abstract:
The present invention provides a method for method substrates, for processing the surface of a substrate having an uneven pattern formed on the surface, the method having: a rinsing step S101 for rinsing the surface of the substrate with a rinsing liquid that contains water; a chemical solution replacement step S102 for bringing a chemical solution into contact with the rinsed surface of the substrate, and replacing liquid adhering to the surface of the substrate from the rinsing liquid to the chemical solution; a state change step S103 for raising the temperature of the substrate wetted by the chemical solution to the critical temperature of the chemical solution or higher to bring the chemical solution into a supercritical state; and, a removal step S104 for removing the chemical solution in the supercritical state from the surface of the substrate, the chemical solution containing an organic solvent (S1) having a greater specific gravity than water (excluding, however, organic solvents having fluorine atoms).
Inventors:
NAMIKI TAKUMI (JP)
WAKIYA KAZUMASA (JP)
WADA YUKIHISA (JP)
WAKIYA KAZUMASA (JP)
WADA YUKIHISA (JP)
Application Number:
PCT/JP2022/034953
Publication Date:
April 06, 2023
Filing Date:
September 20, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2004327894A | 2004-11-18 | |||
| JP2008130685A | 2008-06-05 | |||
| JP2013055230A | 2013-03-21 | |||
| JP2013179244A | 2013-09-09 | |||
| JP2007088257A | 2007-04-05 | |||
| JP2003206497A | 2003-07-22 | |||
| JP2006040969A | 2006-02-09 | |||
| JP2017195312A | 2017-10-26 | |||
| JP2000223467A | 2000-08-11 | |||
| JP2003347261A | 2003-12-05 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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