Title:
METHOD FOR PRODUCING ADHESIVE HOLDING JIG
Document Type and Number:
WIPO Patent Application WO/2023/008086
Kind Code:
A1
Abstract:
The present invention is a method for producing an adhesive holding jig 10 provided with a support substrate 11 and an adhesive agent layer 12 which is provided on the support substrate 11 and which has a relief pattern 13 on a surface 12a thereof, said method comprising: a first step for inserting a nano-implant mold 30 that has a pattern 31 for forming a relief pattern 13 into an upper mold 21 of a mold 20 that has the upper mold 21 and a lower mold 22, and disposing the support substrate 11 in a cavity bottom part 22a of the lower mold 22; a second step for disposing a heat-curing liquid adhesive material 24 on the support substrate 11; a third step for closing and then heating the mold 20 so as to integrally bond and mold the support substrate 11 and the heat-curing liquid adhesive material 24; and a fourth step for opening the mold 20 and removing an adhesive holding jig 10 that has been molded.
Inventors:
HOZUMI SATOSHI (JP)
HATSUMI TOSHIAKI (JP)
HATSUMI TOSHIAKI (JP)
Application Number:
PCT/JP2022/026253
Publication Date:
February 02, 2023
Filing Date:
June 30, 2022
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
B29C39/10; B29C33/42; B29C39/24; B29C39/26; B29C59/02
Foreign References:
| JP2002016103A | 2002-01-18 | |||
| JP2017007187A | 2017-01-12 | |||
| JP2017154273A | 2017-09-07 | |||
| JP2001110847A | 2001-04-20 | |||
| JP2016192519A | 2016-11-10 |
Attorney, Agent or Firm:
SAKAMOTO & PARTNERS (JP)
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