Title:
METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/127666
Kind Code:
A1
Abstract:
A method for producing a bonded body that is obtained by sequentially bonding a base material A, a solid bonding agent which is mainly composed of an amorphous thermoplastic resin that is composed of at least either a thermoplastic epoxy resin or a phenoxy resin, and a base material B in this order, wherein: at least the base material A is a thermoplastic resin base material; and the amorphous thermoplastic resin has an epoxy equivalent weight of 1,600 g/eq. or more, or alternatively, the amorphous thermoplastic resin does not contain an epoxy group, and the amorphous thermoplastic resin has a heat of fusion of 15 J/g or less. This method for producing a bonded body has a superposing step and a bonding step (1), or alternatively has a bonding step (2-1) and a bonding step (2-2).
Inventors:
TAKAHASHI NOBUYUKI (JP)
MORI MASATOSHI (JP)
MORI MASATOSHI (JP)
Application Number:
PCT/JP2022/047240
Publication Date:
July 06, 2023
Filing Date:
December 21, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J5/06; B29C65/40; C09J7/35; C09J163/00; C09J171/12
Domestic Patent References:
| WO2018124215A1 | 2018-07-05 | |||
| WO2022209116A1 | 2022-10-06 |
Foreign References:
| JPS5689520A | 1981-07-20 | |||
| JP2015533191A | 2015-11-19 | |||
| JPH1071685A | 1998-03-17 | |||
| JP2011126942A | 2011-06-30 | |||
| JP2001019743A | 2001-01-23 | |||
| JPS56106983A | 1981-08-25 | |||
| JP2017052907A | 2017-03-16 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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