Title:
METHOD FOR PRODUCING BONDED MULTILAYER BODY OF POLYMER AND ADHEREND
Document Type and Number:
WIPO Patent Application WO/2019/244980
Kind Code:
A1
Abstract:
The present invention provides a method for easily producing a bonded multilayer body at low cost, which improves adhesion between a polymer and an adherend, with an adhesive being interposed therebetween. A production method according to the present invention is a method for producing a bonded multilayer body of a polymer and an adherend, which is characterized by comprising a surface treatment step wherein the polymer is reacted with halogen oxide radicals, and a bonding step wherein the polymer and the adherend are bonded to each other by applying an adhesive to at least one of the surface of the polymer after the surface treatment step or the surface of the adherend, and which is also characterized in that the polymer has an aromatic ring in the main chain.
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Inventors:
OHKUBO KEI (JP)
ASAHARA HARUYASU (JP)
INOUE TSUYOSHI (JP)
ASAHARA HARUYASU (JP)
INOUE TSUYOSHI (JP)
Application Number:
PCT/JP2019/024504
Publication Date:
December 26, 2019
Filing Date:
June 20, 2019
Export Citation:
Assignee:
UNIV OSAKA (JP)
International Classes:
C09J5/02; B32B27/00; C08J7/12; C09J4/04
Domestic Patent References:
| WO2017104798A1 | 2017-06-22 | |||
| WO1989010208A1 | 1989-11-02 | |||
| WO2012117850A1 | 2012-09-07 |
Foreign References:
| GB923846A | 1963-04-18 | |||
| JP2008291168A | 2008-12-04 | |||
| JPH06340759A | 1994-12-13 | |||
| JP2000109584A | 2000-04-18 | |||
| JPH07509750A | 1995-10-26 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
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