Title:
METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE FILM, TOUCH PANEL SENSOR AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2018/042979
Kind Code:
A1
Abstract:
The present invention addresses the problem of easily producing a conductive film which is provided with a thin metal wire that has a narrow line width, while exhibiting excellent adhesion to a substrate. A method for producing a conductive film according to the present invention sequentially comprises, in the following order: a step for forming a first metal film on at least one main surface of a substrate; a step for forming a second metal film, which contains a main component that is different from the main component of the first metal film, on the first metal film; a step for forming a resist film, which is provided with an opening part having a line width of 2.0 μm or less, in a region on the second metal film, where a thin metal wire is to be formed; a step for forming a third metal film; a step for removing the resist film; a step for removing the second metal film with use of a second etching liquid, while using the third metal film as a mask; and a step for removing the first metal film with use of a first etching liquid, while using the third metal film as a mask.
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Inventors:
ICHIKI TAKAHIKO (JP)
Application Number:
PCT/JP2017/027456
Publication Date:
March 08, 2018
Filing Date:
July 28, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G06F3/041; B32B7/02; H01B5/14; H01B13/00
Domestic Patent References:
| WO2014156489A1 | 2014-10-02 |
Foreign References:
| JP2005329559A | 2005-12-02 | |||
| JP2016126674A | 2016-07-11 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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